Quality Management in Technology 2019

(269 Seiten, farbig, ISBN-10: 1079956530; ISBN-13: 978-1079956535

Kindle, Independently published (12. Juli 2019))


Introduction to Quality Management in the Semiconductor Industry

(474 Seiten, farbig, ISBN-10: 1535046341; ISBN-13: 978-1535046343

CreateSpace Independent Publishing Platform, Auflage 1, Aug 2016)


Quality Management in Technology 2018

(310 Seiten, farbig, ISBN-10: 1985895137; ISBN-13: 978-1985895133

CreateSpace Independent Publishing Platform, 2018)


Zero Defects - Dead or Alive?

(78 Seiten, farbig, ISBN-10: 1986606295; ISBN-13: 978-1986606295)

CreateSpace Independent Publishing Platform, 2018)




- "Customer-oriented optimization of the airplane boarding process", Journal of Air Transport Management 76 (2019) 31-39

- "How to fully Capitalize on Advanced Process Control through a Quality Management System", 17th European advanced process control and manufacturing (apc|m) Conference, Dublin, Ireland, April 10 - 12, 2017, W. Bergholz, J. Wittmann, www.apcm-europe.eu/conference/agenda/

- "Success Factor Proven Reliability of PV Modules and Systems", EU PVSEC Conference Munich, June 2016, Poster Contribution 5BV.2.59, W. Bergholz, A. Reykov, J. Wittmann

- "Success Factor Proven Reliability of PV Modules", Intersolar Europe, Munich, June 2015, W. Bergholz, J. Wittmann

- "Genauer hingeschaut", Qualität und Zuverlässigkeit, Dez. 2009, J. Wittmann, G. Kann

- "Wert der Bewertung", Qualität und Zuverlässigkeit, Nov. 2006, J. Wittmann, W. Bergholz

- "Standardized Si wafers for commodity markets - Is there a need, are there technical challenges?", Semicon Europe 2006 (Munich), April 5th, 2006, W. Bergholz, J. Wittmann, H. Öfner

- "Monte Carlo Simulation of capacitor shorts in trench based DRAMs", Journal of the Electrochemical Society, 152(2), p. G148 - G151, 2005, J. Wittmann, C. Kupfer

- "Future trends of wafer types and materials in ULSI technology", The 4th International Symposium on Advanced Science and Technology of Silicon Materials (JSPS Si Symposium), Nov. 2004, Kona, Hawaii, USA; W. Bergholz, J. Wittmann, H. Tews

- "Prospects for new wafer types and materials in semiconductor technology and factors for their successful introduction", Solid State Phenomena Vols. 95-96 (2004), pps. 665-674; W. Bergholz, J. Wittmann, R. Winkler, H. Tews, R. Fehlhaber

- "Next generation Silicon Wafers", Business Briefing: Global Semiconductor Manufacturing Technology, August 2003, Reference Section; W. Bergholz, J. Wittmann, H. Tews, R. Fehlhaber

- "Cost vs. benefit and other factors of the successful implementation of new wafer types", Semicon Europe 2003 (Munich), April 3rd, 2003; H. Tews, J. Wittmann, R. Fehlhaber, W. Bergholz

- "Elymat Measurement of Intentionally Contaminated and Dry Etched Wafers", Journal of the Electrochemical Society, 146(1), p. 313 (1999); J. Wittmann, W. Bergholz, H. Hoffmann

- Relevance and Effects of Metal Contamination on Devices, Processes and Parameters", Semicon Europe 95 (Genf), 3.-6. April 95; W. Bergholz, D. Landsmann, P. Schauberger, J. Wittmann, H. Hoffmann


- Vortrag "Zero Defects in Automotive Semiconductor Manufacturing: Dream or Reality?", Yield Forum Dresden, 23. Oktober 2018

- Session Co-Chair des Silicon Wafer SEMI 4th Standards Workshop der Semicon Europe 2005

- Session Co-Chair des Silicon Wafer SEMI 5th Standards Workshop der Semicon Europe 2006


- "Dynamic random access memory", US6204140; U. Grüning, J. Beintner, S. Halle, J. Mandelman, C. Radens, J. Wittmann, J. Welser

- "Method for making DRAM capacitor strap", US6110792; G. Bronner, C. Radens, J. Wittmann

- "Method for making a self aligned contact", EP0967640A2; J. Wittmann, B. Spuler, D. Dobuzinsky, W. Bergner

- "Methods for protecting device components from chemical mechanical polish induced defects", US05976982, EP00910117A3; M Levy, W. Bergner, B. Fiegl, G. Goth, P. Parries, M. Sendelbach, T. Wang, W. Wille, J. Wittmann

- "Deposition of carbon into nitride layer for improved selectivity for oxide to nitride etchrate for self aligned contact etching", US05935873, EP00908941A3, JP11162952A2; B. Spuler, J. Wittmann, M. Gutsche, W. Bergner, M. Ilg